Each of the 15 inductors were tested at least one time, and several of the inductors were tested multiple times to determine repeatability. Choose from our selection of thermally conductive epoxies, including heat-transfer potting compounds, epoxy potting compounds, and more. A second thermocouple was attached to the exterior of the cooling plate to monitor temperature changes during the test; however, the temperature rise of the cooling plate was less than 2°C even in the most extreme cases and, accordingly, will not be considered further. Pre-mixed, degassed, tested, and frozen polyurethane adhesive. These materials are currently being used in numerous applications to protect sensitive electronic components from excess heat, including LED driver electronics, on-board chargers and inverters for electric vehicles, and electric motor stators. 5108 is a self-leveling material that exhibits low shrinkage once cured and can withstand high temperatures and high humidity or wet environments. Figure 5 shows a representative plot for an inductor potted with Thermoset SC-400 encapsulant with the parameters indicated. Thermally conductive potting compounds are resins designed to encapsulate components or ‘pot’ the entire PCB unit, dissipating heat away from the electronic components and in the process offering additional protection from environmental elements such as water or chemicals. It is a low viscosity alternative to ER2220 system which is ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is … Appli-Tec offers high-performance potting compounds specifically designed for potting, staking, and encapsulating electronics, power supplies, coils, and transformers. With the non-conductive silicone, Thermoset SC-400 encapsulant, nearly two hours was required to reach steady state, whereas a stable temperature was achieved in less than 20 minutes for CoolTherm SC-320 and SC-324 encapsulants. Product: Supreme 121AO. 16,000 cps. The material is ideal for applications requiring a self-leveling room temperature cure and better than average thermal conductivity. Using LORD thermal management materials that provide the unique combination of high thermal conductivity and low viscosity, we have demonstrated substantial reductions in both maximum temperature rise and the time to reach a stable temperature. The trend is towards smaller, lighter, and less expensive components that will save space and reduce costs … UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. 8:00am–5:00pm EST This … The potting compound fills the component enclosure entirely, leaving no air gaps. The cost difference between the two systems was 20%. Key Features: The material cures at room temperature, is low viscosity, has 1.38 W/mK thermal conductivity. Equal mix blush free potting compound pending UL approval. Applications for 0126 … We are a Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. Currently, there is a strong trend toward the electrification of vehicles in the transportation industry, including automobiles, buses, trains, off-road vehicles, watercraft, and aircraft. TIA222G Thermally Conductive … This material is also environmentally friendly and considered non‐hazardous per D.O.T. The cured resin is resistant to a wide or cycling temperature range making it an ideal choice for applications where thermal shock is a potential risk to the electronics, while it is also flame retardant to … Thermally conductive potting compounds are resins designed to encapsulate components or ‘pot’ the entire PCB unit, dissipating heat away from the electronic components and in the process offering additional protection from environmental elements such as water or chemicals. 45,000 cps. 5 hrs/ 3 hrs @ 65°C. Delivered to your inbox once a month. Two part dual cure general potting … Salem, NH 03079. 50-2366FR is a thermally conductive polyurethane potting compound. This rapid temperature recovery means that heat is dissipated quickly and components will spend less time at elevated temperatures, thus increasing the lifetime of the components. Cotronics ® Duralco ® Thermally Conductive Adhesives and potting compounds provide the heat dissipation required for many High Temperature Electronic and Industrial applications. Figure 1 shows thermal conductivity versus viscosity of LORD silicone materials as compared to various competitor products. General one component potting compound pending UL. 832TC Thermally Conductive Epoxy, Potting and Encapsulating Compound Container Format Change PCN Tracking Number: 001-1601-4 Notification Date: 22 January 2016 PCN Effective Date: 22 January 2016 Author: Michel Hachey, Ph.D. Summary: The tall, narrow-mouth, 1 L containers used for the 832TC epoxy made the product difficult to stir and de-air, which lead to … Thanks to new thermally conductive silicone based compound call CoolMag™ to provide an excellent mechanically and thermally well connected critical components to heat-sink or cool plate. One key challenge in developing these types of components is to manage the heat generated by smaller, high-power devices like on-board battery chargers, power inverters and converters, and electric machines. 100:100. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies. Both of these benefits bring about improvements in efficiency and component lifetime, thereby enabling high-performance power electronics. Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. LORD Corporation has been supplying thermally conductive, electrically insulating potting materials to the power electronics industry for over a decade, and recently, we have been testing the effectiveness of using potting compounds with high thermal conductivity to dissipate heat in high-power applications. For a comparison discussion of material chemistries, see our FAQ, The Pros and Cons of Epoxies, Urethanes, and Silicon Adhesives. Technical data sheets for all commercial products can be found using the search bar at the top of this page or here. The lower viscosity allows LORD materials to flow and fill voids more readily while providing excellent thermal conductivity. Provides best-in-class thermal conductivity for applications requiring aggressive heat dissipation of components. The material passes NASA’s outgassing requirements and provides strain relief for many bonding applications where high thermal conductivity isn’t required. A one-part, black, electrically isolating epoxy compound specifically designed for potting and sealing electronic components. Error bars are plus and minus one standard deviation of the data, which includes part-to-part variation and repeatability. Low viscosity thermally conductive two part silicone. This product is designed for applications where thermal management is a concern. The complete set-up is shown in Figure 4. 505-07 A/B. Because the surfaces of both aren’t absolutely smooth at the microscopic level, tiny gaps exist – thus reducing the effectiveness of the contact area. The location of the thermocouple corresponds to the hottest location in the inductor as judged qualitatively from a thermal camera image of an unpotted inductor under load. thermally conductive potting compound wholesale, buy thermally conductive potting compound from 40 thermally conductive potting compound suppliers from China. The type of filler, concentration of particles, their size and shape will determine the thermal conductivity of the product. It uses high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. Dramatic reductions in both temperature rise and equilibration time are observed for inductors potted with thermally conductive materials (see Figure 6). 5336 is supplied in frozen syringes. Key features: Resistant to high temperatures, adheres to dissimilar materials, and self-leveling. An electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Use of thermally conductive compound providing low stress solution is the key. Parker Chomerics THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form in- place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. 3000°F Highly Thermally Conductive, Potting Compound: Durapot™ 810 Alumina based, thermally conductive potting compound and adhesive developed to provide excellent electrical resistance at high temperature and improved thermal conductivity for high power applications. This flexible … The normal potting compound was only 110°C but the potting compound that was five times more thermally conductive was only 113°C. diversified technology and manufacturing company developing highly reliable adhesives, coatings, motion management devices, and sensing technologies that significantly reduce risk and improve product performance. All of the materials are electrically insulating with high dielectric strength and excellent high-temperature stability. Thermal conductivity of a typical unfilled epoxy system has a very low value of 0.14 W/(m•K). By nature, epoxy and polyurethanes are electrically insulative; the degree varies based on the specific formulation. regulations. Plus a little humor too. A black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. Under different test conditions that would generate a temperature rise much greater than 55°C, it is likely that the improvement would be even more pronounced. 10 min @ 177°C. Even the moderately conductive silicones, CoolTherm SC-305 and SC-309 encapsulants at 0.7 and 1.0 W/m∙K, respectively, provided significant improvements. ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. Epic 0154 is a low-temperature heat cure, thermally conductive epoxy potting compound for electrical components. / 1 877 275-5673, Semiconductor Packaging and Circuit Assembly, How Proper Application of Thermally Conductive Materials Will Improve Motor Power Density. SilCool TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs. For more than 90 years, LORD has worked in collaboration with our customers to provide innovative oil and gas, aerospace, defense, automotive and industrial solutions. RoHS compliant. With a Shore A hardness of 70, the soft urethane material provides resistance to vibration, as well as low shrinkage, for minimal stress on components during cure. Convenient mix ratios; UL94 V-0 and UL 746A grades available; Thermally conductive options available; Low exotherm; Excellent dielectric properties; Wide service temperature range ; … In stock and ready to ship. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. This property mix is achieved thanks to minimal thixotropic or pseudoplastic behavior, reducing the risk of air bubbles. 25,000 cps. • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs LEADER IN THERMAL MANAGEMENT: DESIGN, INNOVATION AND MATERIALS TECHNICAL BULLETIN 62 CHO-THERM® 1641 & 1642 Thermally Conductive Silicone Compounds CHO-THERM® 1641 CHO-THERM 1641 compound is a one-component thermally conductive … Thermally speaking, the potting material acts like a heat insulator. Pigmented black for excellent thermal absorption and emission. 100:100 . Power was then applied, and the temperature was monitored until the inductor temperature stabilized. Will cure in deep sections. Key features: High Tg, low shrinkage, flowable, and 3-hour pot life. 3200°F Electrically Resistant Coating: Durapot™ 820 is a 3200°F, one component paint and … LORD CoolTherm SC-305, SC-309, SC-320, and SC-324 Thermally Conductive Silicone Encapsulant are filled silicone potting materials with progressively higher thermal conductivities of 0.7, 1.0, 3.0, and 4.0 W/m∙K, respectively. 45 min/ 24 hrs @ 25°C. SilCool* TIA216G Thermally Conductive Silicone Rubber. Epic 0154 features good electrical properties, minimal settling characteristics and good heat transfer in a single component epoxy. Due to its high thermal conductivity, it protects circuits, by reducing the risk of heat … These ultra-temperature adhesives combine Cotronics ® ’ unique polymer system and special thermally conductive fillers to provide continuous service up to 340°C. An optically clear, low viscosity, electrically isolating epoxy compound, 5051 bonds well to most substrates such as metals, glass, ceramics, and most plastics. The average temperature rise with Thermoset SC-400 encapsulant was about 55°C, and the average rise for the most thermally conductive materials, CoolTherm SC-320 and SC-324 encapsulants, was less than 10°C. Thermally conductive potting compounds are proving to be an ideal method for rapidly and effectively conducting heat away from power components to the heat sink. The five different materials were used to pot three inductors with each material, resulting in a total of 15 potted inductors. The aluminum cooling plate was connected to a temperature-controlled liquid bath; each inductor was tested at coolant temperature set points of 25°C, and the typical automotive coolant temperature of 50°C. 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